‚±‚̃Xƒy[ƒX‚ÉL‚ðo‚µ‚Ü‚¹‚ñ‚©HÚ‚µ‚­‚Í‚±‚¿‚ç‚Ö
¡ƒcƒŠ[ƒCƒ“ƒfƒbƒNƒX@‘啪—Þ„«’†•ª—Þ„«»•i•ª—Þ

6 ŒŸ¸,‘ª’è‘•’u Inspection.Test.Measurement
6-1 ”¼“±‘ÌŒŸ¸‘•’u Semiconductor Inspection & Measurement
6-1-1@ƒEƒGƒnƒ}ƒXƒNŒŸ¸‘•’u Wafer Mask Inspector
6-1-2@‚h‚b^‚k‚r‚hƒeƒXƒeƒBƒ“ƒO‘•’u IC^LSI Testing Equipment
6-1-3@–ŒŒúŒŸ¸‘•’u
6-1-4@ƒvƒ[ƒu
6-1-5@”¼“±‘Ì”M•ÏŒ`—Ê‘ª’è‹@
6-1-30@‚»‚Ì‘¼ŒŸ¸‘ª’è‹@Ší Other Testing Equipment


6-2 ƒ}ƒCƒNƒƒVƒXƒeƒ€ŒŸ¸‘•’u Microsystem Inspection & Measuring
6-2-1@LCDŒŸ¸‘•’u LCD Inspection
6-2-2@TABŒŸ¸‘•’u TAB Inspection
6-2-3@ƒvƒ[ƒu
6-2-4@ƒvƒ[ƒo[


6-3 •”•iŒŸ¸‘•’u Electronic Component Inspection Eq.
6-3-1@‚a‚f‚`ŒŸ¸‘•’u BGA Inspection
6-3-2@‚a‚f‚`ƒ{ƒCƒ“ƒfƒBƒ“ƒOƒpƒbƒhŠOŠÏŒŸ¸‘•’u BGA Bonding Pad Optical Inspection
6-3-3@‚l‚b‚lƒ{ƒCƒ“ƒfƒBƒ“ƒOƒpƒbƒhŠOŠÏŒŸ¸‘•’u MCM Bonding Pad Optical Inspection
6-3-4@‚b‚r‚oƒ{ƒCƒ“ƒfƒBƒ“ƒOƒpƒbƒhŠOŠÏŒŸ¸‘•’u CSP Bonding Pad Optical Inspection
6-3-5@@…»”­UŠíŒŸ¸‘•’u
6-3-6@@ƒ`ƒbƒvŠOŠÏŒŸ¸‹@
6-3-7@@ƒŠƒŒ[ŠOŠÏŒŸ¸‹@


6-4 Šî”ÂŒŸ¸‘•’u PCB Inspection Eq.
6-4-1@@ƒXƒ‹[ƒz[ƒ‹ŒŸ¸‘•’u Through Hole Inspection
6-4-2@ƒxƒAƒ{[ƒhƒeƒXƒ^ŠOŠÏiŠî”ŠOŠÏŒŸ¸‘•’uj Bare Board Tester ( Optical )
6-4-3@ƒxƒAƒ{[ƒhƒeƒXƒ^“d‹C Bare Board Tester ( Circuit )
6-4-4@“±‘Ì’ïR‘ª’è‘•’u
6-4-5@–ÚŽ‹Šm”FƒXƒe[ƒVƒ‡ƒ“ Visual Inspection Station
6-4-6@XüŒŸ¸‘•’u X ray Inspection
6-4-7@”ÂŒú‘ª’èŠí Thickness Inspection
6-4-8@‚¯‚¢Œõ‚wü–ŒŒúŒv
6-4-9@ƒÀü–ŒŒúŒv Bata-ray Thickness Inspection
6-4-10@À•W‘ª’èŠí
6-4-11@‚ß‚Á‚«Œú‚³‘ª’èŠí Plating Thickness Tester
6-4-12@ŽOŽŸŒ³‘ª’è‘•’u 3D Inspection
6-4-13@VƒJƒbƒgŽcŒú‘ª’èŠí V cut Inspection ( Thickness )
6-4-14@VƒJƒbƒgƒsƒbƒ`‘ª’èŠí V cut Inspection ( Pitch )
6-4-15@ƒXƒsƒ“ƒhƒ‹c‚Ԃꑪ’èŠí
6-4-16@Ž©“®•züŒŸ¸‹@
6-4-17@ƒeƒXƒgƒvƒ[ƒuAƒvƒ[ƒuƒeƒXƒ^[ Test Prober
6-4-18@ƒz[ƒ‹ƒ`ƒFƒbƒJ[ Through Hole Checker
6-4-19@ƒ†ƒjƒo[ƒTƒ‹Ž¡‹ï
6-4-20@ƒƒCƒ„ƒŒƒXŒŸ¸–è‹ï
6-4-21@“±“d«ƒSƒ€•ûŽ®ŒŸ¸Ž¡‹ï
6-4-22@“d‹CŒŸ¸Ž¡‹ï Circuit Tester
6-4-23@“d“±“xŒv Conductivity Tester
6-4-24@Šî”ƒCƒ“ƒr[ƒ_ƒ“ƒX•”gŒ`Œv‘ª“¯Ž²ƒvƒ[ƒu
6-4-25@Šî””M•ÏŒ`—Ê‘ª’è‹@
6-4-26@@ƒXƒ‹[ƒz[ƒ‹ŠÔ‚ß‚Á‚«Œú‚΂ç‚‚«ŒŸ¸‘•’uiƒNƒƒXƒZƒNƒVƒ‡ƒ“Œãj
6-4-27@@ƒŒ[ƒU[ƒrƒAŒŸ¸‘•’u


6-5 ŽÀ‘•A‚Í‚ñ‚¾•tŒŸ¸,‘ª’è‘•’u Assembly,Soldering Inspection, Measure Eq.
6-5-1@ƒ\ƒ‹ƒ_[ƒy[ƒXƒg”S“xŒv Soldering Paste viscosity Tester
6-5-2@@‚Í‚ñ‚¾‚Ê‚ê«ŽŽŒ±Ší Wetting Tester
6-5-3@ƒ^ƒbƒLƒ“ƒOƒeƒXƒ^[ Tacking Tester
6-5-4@ˆóüƒ\ƒ‹ƒ_[ƒy[ƒXƒgŠOŠÏŒŸ¸‘•’u Printed Solder Paste Inspection
6-5-5@ICƒŠ[ƒhŠOŠÏŒŸ¸‘•’u IC Lead Inspection
6-5-6@“Љe‹@EŠg‘勾Eƒ‹[ƒy Microscope, Magnifying Lens
6-5-7@Xü‚Í‚ñ‚¾•t‚¯Œ`óŠOŠÏŒŸ¸‘•’u X-ray Soldered PCB Inspection
6-5-8@@ŒõŠw‚Í‚ñ‚¾•t‚¯Œ`óŠOŠÏŒŸ¸‘•’u Optical Soldered PCB Inspection
6-5-9@ƒCƒ“ƒT[ƒLƒbƒgƒeƒXƒ^ Incircuit Tester
6-5-10@ƒeƒXƒgƒvƒ[ƒuiƒ`ƒFƒbƒJ[ƒsƒ“j Test Probe ( Checker Pin )
6-5-11@ƒCƒ“ƒs[ƒ_ƒ“ƒX‘ª’è‘•’u
6-5-12@ƒtƒ@ƒ“ƒNƒVƒ‡ƒ“ƒeƒXƒ^ Function Tester
6-5-13@ƒCƒIƒ“ƒ}ƒCƒOƒŒ[ƒVƒ‡ƒ“•]‰¿EŒv‘ªƒVƒXƒeƒ€ Ion Migratian Measurement
6-5-14@´ò“x‘ª’èŠí Cleanliness Tester
6-5-15@BGAŒŸ¸‘•’u BGA Inspection
6-5-16@‰·Ž¼“xŽŽŒ±Ší Thermal & Humidity Tester
6-5-17@‰·“xƒTƒCƒNƒ‹ŽŽŒ±Ší Thermal Cycle Tester
6-5-18@”MÕŒ‚ŽŽŒ±‘•’u Heat Cycle Tester
6-5-19@@‰·“xƒvƒƒtƒ@ƒCƒ‹‘ª’è‘•’u
6-5-20@@ƒŠƒtƒ[ƒVƒ~ƒ…ƒŒ[ƒ^[
6-5-21@ƒtƒ[‚Í‚ñ‚¾•tŒŸ¸‘•’u
6-5-22@ôò‰t…•ªŒv
6-5-23@@—n—Z‚Í‚ñ‚¾•\–Ê’£—ÍŒv@Molten solder surface tension tester
6-5-24@@”M“d‘Îü@Thermocouple
6-5-25@@ ƒŠƒtƒ[Žž”½‚葪’è‘•’u
6-5-26@‚Í‚ñ‚¾‡‹à‚Ì•ªÍ‘•’u


6 ŒŸ¸,‘ª’è‘•’u Inspection.Test.Measurement
6-6@ƒIƒvƒgŒŸ¸‘ª’è‘•’u
6-6-1@Œõ‘ª’èŠí Optical Measuring Equipumen
6-6-2@Œõ‰ž—pŒv‘ªŠí Optical Sensors@
6-6-3@ƒŒ[ƒU[‰ž—p‘ª’èŠí

6 ŒŸ¸,‘ª’è‘•’u Inspection.Test.Measurement
6-7@–}—pŒŸ¸‘ª’è‘•’u General Inspection & Measurement
6-7-1@@Œ°”÷‹¾ Microscope
6-7-2@‹à‘®Œ°”÷‹¾ Metal Microscope
6-7-3@H‹ïŒ°”÷‹¾ Tool Microscope
6-7-4@‚RŽŸŒ³‘ª’è‘•’u
6-7-5@’·‹——£Œ°”÷‹¾
6-7-6@ÔŠOüŒŸ¸‘•’u
6-7-7@“dŽqŒ°”÷‹¾
6-7-8@Œv‘ªƒJ[ƒh
6-7-9@Ú‡‹­“xŽŽŒ±‹@
6-7-10@@އŠOüd‰»‘•’u
6-7-11@@ŒŸ¸—p‰æ‘œˆ—‘•’u
6-7-12@“dŽ¥”g‘ª’è‘•’u
6-7-13@¶Þ½ŒŸ¸‘•’u
6-7-14@ƒeƒXƒ^[



€–Ú‚ðƒNƒŠƒbƒN‚µ‚Ä‚­‚¾‚³‚¢B
yƒgƒbƒv‚Öz@


(c) 2000 Copyrighti—LjˆÀ•”ŽÀ‘•‹ZpŒ¤‹†Š