１．Characteristics
- Cross-linked silicone particles dispersed
in epoxy resin relieves stress from
thermal
shocks and also from being dropped.
- It doesn’t crack.
- It absorbs flux residue which allows for
better filling underneath the device.
- Synergy between silicone and filler makes
the CTE drop lower. With the same
filler
content(%), Ep silicone has lower
CTE level
than ordinary epoxy.
- Lower CTE works to relieve stress that UF
causes on a PCB in the process of
curing.
Ep Silicone Sea Island structure |
 |
＜Ep silicone sea island structure＞
Sunstar’s original polymer technology innovated
epoxy silicone sea island structure. This
structure makes the epoxy resin flexible
and hard to crack. It absorbs stress from
thermal shocks and from being dropped. Sunstar’s
underfills are all based on this structure. |
SEM pix
Ep silicone |
 |
It absorbs flux residue left on a PCB.
The underfill absorbs flux residue and thereby
prevents voids from affecting the reliability
of underfilled CSPs.
|
| ＜experiment＞ |
Apply flux on to FR-4 ⇒ heat 3 min. at
220 degrees⇒ apply UF from above and cures
at 150 degrees 30 minutes ⇒ cross-section
examination |
 |
| ２．Physical property |
|
1090 |
1091E |
1092 |
1093A |
others |
| Cure Condition |
150Degree C
×10min |
150Degree C
×30min |
150Degree C
×10min |
125Degree C
×20min |
|
| Application |
mobile |
mobile/car |
mobile/car |
Mobile/car |
|
| Key Word |
flexible |
for WLCSP |
for WLCSP |
for WLCSP |
|
| Appearance |
yellow |
black |
black |
black |
|
| Viscosity（ｍPa・ｓ） |
5000 |
1500 |
7000 |
11200 |
BH type 20Degree C |
| Filler（%） |
- |
30 |
60 |
50 |
|
| Tg （Degree C） |
122 |
134 |
148 |
120 |
TMA |
CTE α１
α２ |
88 |
49 |
24 |
38 |
TMA |
| 205 |
98 |
84 |
54 |
| Flexural modulus（N/ｍｍ2） |
3500 |
3500 |
7000 |
4400 |
JIS K 6911 |
| Flexural strength（N/ｍｍ2） |
110 |
125 |
130 |
110 |
JIS K 6911 |
| Adhesion |
4 |
4 |
8 |
9.3 |
JIS K6850 Al- Al |
|
|
RD-11262 |
1094 |
RD-0324GF40 |
RD-0324G1 |
Others |
| Cure Condition |
125Degree C
×20min |
150Degree C
×30min |
150Degree C
×30min |
150Degree C
×30min |
|
| Application |
car |
Car/FC |
FC |
FC |
|
| Key Word |
Low CTE |
Low CTE |
High flowability |
High flowability |
|
| Appearance |
Black |
Black |
Black |
Black |
|
| Viscosity （ｍPa・ｓ） |
51400 |
60000 |
2500 |
8200 |
BH 20Degree C |
| Filler（%） |
63 |
70 |
40 |
55 |
|
| Tg （Degree C） |
127 |
139 |
134 |
127 |
TMA |
CTE α１
α２ |
25 |
20 |
42 |
32 |
TMA |
| 45 |
45 |
71 |
67 |
| Flexural modulus（N/ｍｍ2） |
6500 |
9000 |
3200 |
6200 |
JIS K 6911 |
| Flexural strength（N/ｍｍ2） |
120 |
120 |
120 |
120 |
JIS K 6911 |
| Adhesion |
8.5 |
8 |
7 |
6 |
JIS K6850 Al- Al |
|
Sunstar Engineering Inc.
UTOMOTIVE BUSINESS UNIT
Sales Department E-Material Project Senior Sales Engineer
5-30-1 Kamihamuro-cho Takatsuki-shi
Osaka Japan 〒569-1044
TEL:+81(0)72-695-3940 FAX:+81(0)72-695-3622
E-mail: tomoyuki.katayama@sunstar.com |
