REWORKABLE UNDERFILL

Reworkable
Underfill		 Index CONTACT Japanese

REWORKABLE UNDERFILL
Penguin Cement 991/991M/992/991D

☆The adhesion society of Japan
Ａward-winning material for adhesion technology
1. Characteristics

　　　①Low temp. snap cure
　　　　　　　　⇒500μｍ　layer of the material takes only 1 second to gel at over 70 degrees.
　　　②Excellent reworkability allows for the wiping of the resin residue on a PCB.
　　　③Excellent electrical insulation
　　　④Excellent storage stability at 5～10degree C
　　　⑤Endure bending stress
　　　⑥High shock absorbing property with strong urethane elasticity
　　　⑦Allows for the use of various thermal treatment system
　　　　 (example：radio frequent dielectric heating systemultra sonic heating system)　

Reworkability

　Urethane based underfill, 991 series, eliminates the stressful process of taking the underfilled CSP off and cleaning the material residue off of the PCB. 　The underfill chemically dissolves after a heat treatment and allows for an easy wiping of any reside left on the PCB, making it possible for engineers to analyze a defect device and also save expensive PCBs.
REWORKABLE UNDERFILL rework process
Endurance against bending stress
REWORKABLE UNDERFILL Endurance against bending stress

Sunstar’s urethane underfills possess excellent bending stress endurance that is often required by mobile electronics.

Drop Shock test
REWORKABLE UNDERFILL drop shock test


Elastic rubber like urethane underfill has excellent shock absorbing characteristics and extends the fatigue life of CSP solder joints.

2. Physical Property
Property 991 991M 992 991D other
Cure Condition 80Degree C
×10min		 80Degree C
×10min		 80Degree C
×10min		 80Degree C
×10min
100Degree C
×7min		 100Degree C
×7min		 100Degree C
×7min		 100Degree C
×7min
120Degree C
×3min		 120Degree C
×3min		 120Degree C
×3min		 120Degree C
×3min
Dissolution temp.(Degree C) 200 230
＊for Sn-Ag-Cu		 200 200 ＴＭＡ
viscosity (mPa・s) 5400 5000 8360 27000 BH type 20Degree C
vis. ratio 1 1 1.08 2 2/20rpm(23Degree C)
Specific gravity 1.08 1.07 1.08 1.08 20Degree C
Gelation （second） 7 7 7 5 80Degree C/200μｍ
Degree of hardness 85 84 95 95 JISA type JISK-6301
Dumbbell 　M50（N/mm2）
rupture strength（N/mm2）
elongation/ ruptuure（%）		 2.6 2.3 8.3 7.4 （20Degree C）JIS-K6301
4.1 5.4 10.8 10.5
180 190 230 200
CTE 　　　　　　α1
（ppm/Degree C）　　　α2		 68 67 62 65 ＴＭＡ
197 197 190 192
Tg 　　　　（Degree C） -85 -85 -85 -80 ＴＭＡ
volume resistance （Ωcm） 1.2×1012 2.2×1013 1.5×1013 2.1×1013 （20Degree C）JIS-K6911
insulation resistence
（Ωcm）85Degree C×85%		 3.0×109 3.0×109 1.2×1010 2.0×1010 JIS2 IR
100ｖ
dielectric constant　(ε) 4 3.7 3.86 3.79 JIS-K6911
1MHｚ20Degree C
dielectric dissipation
factor （tan δ）		 0.034 0.043 0.05 0.037
adhesion　 （N/mm2） 7 7.9 10.9 9.5 FR-4
Water absorption 　（%） 0.85 0.95 1.1 1 Boiling test 2hr
Storage stability （10Degree C） 6 months 3 months 4 months 4 months 10Degree C
Sunstar Engineering Inc.
UTOMOTIVE BUSINESS UNIT　
Sales Department E-Material Project Senior Sales Engineer
5-30-1 Kamihamuro-cho Takatsuki-shi
Osaka Japan 〒569-1044
TEL:+81(0)72-695-3940 FAX:+81(0)72-695-3622
E-mail: tomoyuki.katayama@sunstar.com